Internship in Semiconductor Packaging

Support technology development and research activities in the development of semiconductor power modules, i.e. process development and prototype manufacturing in a state-of-the-art cleanroom. Perform accelerated lifetime testing, characterize modules before and after aging, supervise the test setup. Perform first steps of the root cause analysis (X-ray, SAM, cross section etc.) and concisely document the test results. Perform electromagnetic and thermal infinite element simulations to validate design features. Create CAD designs of power modules in close collaboration with the team, find creative and efficient solutions to meet demanding and sometimes conflicting requirements.

We are a technology-driven company with a strong focus on innovation, continuous improvement, and sustainable manufacturing. We offer flexible working conditions, dedicated mentorship, and a supportive, inclusive environment where you can grow personally and professionally – empowering you to thrive while balancing life and work.

• Currently pursuing a M.Sc. degree in material science, electrical engineering, physics, chemistry or similar discipline (advanced B.Sc. or M.Sc. degree); official enrollment essential

• Experience in laboratory work and know-how in experimental methods using a wide range of advanced materials characterization techniques

• Solid programming skills (e.g. LabVIEW, Python, Matlab etc.)

• Experience with finite element modeling advantageous (ANSYS Q3D, COMSOL)

• Know-how in data analysis tools and statistics is advantageous

• Enthusiastic, self-motivated mindset and ability to work independently as well as highly conscientious individual with keen sense of responsibility

• Fluency in written and spoken English and good communication and technical writing skills

• Motivated and eager to learn more and become part of a multidisciplinary research team focused on innovation