Product Engineer – Power Semiconductors Module Packaging (BiMOS)

Monitor, analyze, and interpret yield and quality data to identify improvement opportunities and drive sustainable enhancements in cost, quality, and yield. Lead and execute improvement projects using methodologies such as Six Sigma, Lean Manufacturing, 8D, and related frameworks. Take full product ownership after R&D handover, including coordination and monitoring of new product ramp up in the fabrication line. Perform root cause analysis and troubleshooting of product defects, weaknesses, and quality issues, deriving clear conclusions on process and design gaps. Maintain, enhance, and implement data acquisition, analytics, and reporting methods to support data driven decision making. Support process and R&D engineers with strong technical expertise and structured problem-solving approaches.

Based in Lenzburg, Switzerland, you will take end-to-end ownership of a product platform and drive its optimization using advanced data analysis and continuous improvement methods. Your work will directly impact product quality, yield, and cost competitiveness in high power semiconductor manufacturing.

• Master’s degree or PhD in Physics, Electrical Engineering, or a related discipline

• Strong expertise in statistical analysis, problem solving methodologies, and advanced data analysis techniques

• Semiconductor manufacturing experience is an advantage

• Proven experience leading complex improvement projects, ideally with small, cross functional teams

• Comfortable working in an international, matrix organization, with excellent communication and collaboration skills

• Innovative, quality driven team player with a high willingness to learn and take ownership

• Very good command of German and English (written and spoken, B2/C1 level)