R&D Internship in Semiconductor Power Module

Develop new packaging technologies for power electronics (PE) modules to enable higher current capability, sustain higher temperatures and stresses under harsh environmental conditions. Support the build-up and characterization of prototypes of IGBT modules for quality assessment using several techniques such as scanning acoustic microscopy, cross-sections, electrical and reliability testing. Conduct design of experiments (DoEs) to support technology development through process and materials optimization. Interact and collaborate with a dynamic and multidisciplinary team that will supervise and guide the project. Use your strong technical background, motivation to develop innovative solutions, and goal-oriented approach to make a significant impact on the project.

We are a technology-driven company with a strong focus on innovation, continuous improvement, and sustainable manufacturing. We offer flexible working conditions, dedicated mentorship, and a supportive, inclusive environment where you can grow personally and professionally – empowering you to thrive while balancing life and work.

• Currently pursuing a degree in material sciences, mechanical engineering, chemistry, physics, or similar discipline (B.Sc. or M.Sc. degree internship and/or thesis)

• Experience in laboratory work and know-how in sample preparation and material characterization techniques

• Know-how in data analysis tools and statistics is advantageous

• Strong problem-solving skills, with the ability to think creatively and independently to resolve technical challenges

• Excellent communication skills, both written and verbal, to effectively document the design and present results to the team

• Fluent in written and spoken English

• A self-starter with a strong work ethic and the ability to work independently or as part of a team

• Willingness to learn new concepts and technologies related to semiconductor packaging