Master Thesis

SiC device testing both at wafer or package level Implementation of new test methodologies for SiC devices Design and/or improvements of existing testing hardware and software (e.g. PCBs, DAQs, data analysis scripts) Data analysis to quantify device performance and reliability, including high volume data Prepare documentation and reports for R&D; colleagues

We are a technology-driven company with a strong focus on innovation, continuous improvement, and sustainable manufacturing. We offer flexible working conditions, dedicated mentorship, and a supportive, inclusive environment where you can grow personally and professionally – empowering you to thrive while balancing life and work.

• Currently pursuing a Master Degree in Electronic, Electrical and Mechanical Engineering or Applied Physics

• Basic knowledge of hardware development and integration (e.g. data acquisition, PCBs, etc..)

• Basic knowledge or interest in semiconductor device physics, power devices, particularly SiC knowledge would be a big plus

• Basic knowledge of statistical methods for data analysis and software such as Minitab or Python

• Good communication and presentation skills in English